1 : the feature on the pins or leads which keeps the body of a dual inline or pin grid array semiconductor package from contacting the surface of a printed circuit board to which the leads are soldered. [SEMATECH] 2 : the distance that the body of a semiconductor package is held off the circuit board to which the package leads are soldered. [SEMATECH] Also see seating plane . 3 : standoff features, such as raised plastic areas; these may also be designed into the body of plastic packages. [SEMATECH]
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