1 : in the manufacture of plastic semiconductor packages, the plastic excesses that remain after normal molding, deflashing, trimming, and singulation processing. [SEMI G14-88] Also called parting line protrusions or intrusions. 2 : a surface defect on molded packages that consists of parent material. [SEMATECH] Also called top or bottom protrusions. Also see bubble, blister ceramic, blister metal, and projection. 3 : the dambar section of a leadframe (tab) that remains after dambar trimming when the trimming punch is not totally in line with the lead shoulder by design or misalignment. [SEMATECH] Also called lead shoulder protrusions or intrusions and shoulder width intrusions.
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