1 : in a wafer surface, a depression in a wafer surface that has steeply sloped sides which meet the surface in a distinguishable manner, in contrast to the rounded sides of a dimple. [ASTM F1241] Also see slip and dislocation. 2 : in semiconductor packages, plastic or ceramic, or in the leadframes, a shallow depression or crater. The bottom of the depression must be visible in order for the term to apply. A pit is formed during the component manufacture. [SEMI G61-94] Contrast chip. 3 : in flat panel display substrates, a small indentation on the glass substrate surface. [SEMI D9-94]
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