in the leadframe of a dual inline semiconductor package produced by etching, a beveled edge caused by the etchant attacking the metal laterally as well as vertically. [SEMI G19-84] Also see etch factor.
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in the leadframe of a dual inline semiconductor package produced by etching, a beveled edge caused by the etchant attacking the metal laterally as well as vertically. [SEMI G19-84] Also see etch factor.