a technique for evaluating the integrity of semiconductor die attachment. Semiconductor die are sensitive to voids in the die attach medium-organic resin, metal alloys, or solders. The voids impede the flow of heat away from the die to the package or substrate and may also create cracks in the die when it is exposed to large temperature variations in thermal testing. Tests may be conducted on unencapsulated thermal test chips or on active devices . [SEMATECH]
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