a reactive etch solution composed of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2) to remove organic contaminants from a silicon wafer or a film such as SiO2. [SEMATECH]
Search the Dictionary
© chemicool.com
Tools |
Periodic Table |
Citing Chemicool |
About |
Privacy |
Contact |
Archive
1 |
Science network |
Forum |
